Nakamura Choukou's main businesses are development, manufacturing and sale of diamond wires, which are used in the slicing process to manufacture silicon wafers for solar cells. A diamond wire is a threadlike sawing tool with diamond grains firmly attached to a fine piano wire. Diamond wires are rapidly spreading as they reduce the cost in manufacturing silicon wafers (*1). The affiliated Company deals with slicing business using the diamond wires, which adds strength to the Company's business of manufacturing and sale of diamond wires. The Company is also focusing on the early launch of new businesses.
Wafers (*1)
A wafer is a flat functional part that is produced by thinly slicing ingots of electronic materials. It is made of various materials by purpose such as silicon, sapphire, SiC (silicon carbide) and GaN (gallium nitride). Silicon wafers are often used for IC chips and solar cells.
1-1 Corporate history
"Nakamura Steel Works" (the predecessor of Nakamura Choukou) was established in October 1954 in Sakai City, Osaka Prefecture as a machine screw manufacturer for sewing machines. "Nakamura Choukou Co., Ltd." was established in December 1970, which mainly manufactured cutting tools and wear-resistant tools made of cemented carbide. The Company switched the main material from cemented carbide to diamond in 1988 and started the development, manufacturing and sale of diamond nozzles (*) in 1993. The Company supported the manufacturing innovation for the IT industry and its business expanded. In 2004 after the burst of the dot-com bubble, the Company started the research and development for the current main product, diamond wire, whose target was the energy industry and started distributing it in 2010. The Company overcame the impact of the financial crisis in 2008 by dealing with not only the manufacture and distribution of diamond wire but also the slicing business. The Company was listed on Mothers of Tokyo Stock Exchange in June 2015.
Diamond nozzles (*)
A nozzle with sintered diamond at the tip, which is used for mounting electronic components on a print circuit board. By using diamond, the lifespan of the nozzle, holding capacity of the electronic component, image recognition efficiency and mounting efficiency are improved.

1-3 Market environment
(1) The continuous expanding demand for solar power energy
The use of renewable energy is promoted globally for the reduction of greenhouse gas emissions causing global warming. Among these kinds of renewable energy, solar power is regarded as central way of electric generation.

The demand for solar power generation is strong in this situation and the installation amount has risen sharply mainly in China and India since 2015.
(2) Expansion of the Polycrystalline Silicon Wafer Market and Diamond Wire
Along with the spread of solar power generation, the demand for silicon wafers used in solar panels is increasing.
Silicon wafers are roughly classified into monocrystalline silicon wafers and polycrystalline silicon wafers, but each of them has advantages and disadvantages.

In the past, polycrystalline silicon wafers with good yield and of low price were mainly used, but monocrystalline silicon wafers are becoming mainstream due to the total cost performance including their high efficiency of energy conversion and their panel installation with excellent processing quality.
The diamond wire used for slicing silicon wafers are showing an explosive growth.
Japanese companies, including Asahi Diamond Industries Co., Ltd. (6140, the first section of Tokyo Stock Exchange (TSE)) and the Company, globally had the largest market share of diamond wires; however, Chinese manufacturers have been rising lately and, seemingly, their total market share has exceeded that of Japanese companies.
However, in order to take in the expanding demand for monocrystalline silicon wafers, the Company has been promoting technological innovation for thinning and drastic cost reduction and is proceeding with differentiation from a Chinese diamond wire.

1-4 Business contents
1. Segment
Nakamura Choukou's businesses consist of the three segments: Peripheral Business of Electronic Material Slicing, High-precision Equipment, and Chemical Fiber Spinning Nozzle Businesses.
(1)Peripheral Business of Electronic Material Slicing
The development, manufacturing, and distribution of diamond wire which is used in the slicing silicon ingot during the manufacturing process of solar cells.
①What is Diamond wire?
◎Manufacturing Process of Silicon Wafer
Nakamura Choukou's diamond wire is used in the slicing process in manufacturing silicon wafers, which are used for the main part of a solar battery panel, that is, a solar cell.
A "diamond wire" is a tool used to thinly slice rectangular silicon ingots that are pre-cut to the dimensions of each wafer. It is a threadlike slicing tool made of a thin piano wire with diamond granules firmly attached and is thinner than a human hair.
The ingots are sliced by the diamond wires juxtaposed at short intervals and rotating at high speed over the guide rollers on a slicer. 2000 to 3000 silicon wafers are produced in 2 to 3 hours. The wafers are then cleaned and quality-inspected, treated to turn into cells, and incorporated into solar panel modules.
②Diamond Wire Overview
There are two methods of slicing silicon wafers; "loose grain method" and "fixed grain method (using diamond wires)."

The facts about "improved processing speed," "low running cost," "reduced kerf loss" and "eco-friendliness with a reduced amount of required wires" mentioned above contribute to the expansion of transfer to and the demand for the "fixed grain method" using diamond wires.

Additionally, Nakamura Choukou is making efforts to further thin the diamond wire since increasing the number of silicon wafers produced from an ingot is an important advantage for wafer manufacturers in terms of production efficiency and cost reduction.
Nakamura Choukou had thinned the diamond wire to Φ (*) 80 μm from the conventional standard of Φ100 μm and from this term, the Company made Φ60 μm diamond wires the main product while Φ70 μm diamond wires are the main stream currently in this field. Moreover, the Company is aiming to create Φ50 μm diamond wires for a practical use.
(*)Φ
A symbol to indicate the diameter. Phi.
Also, the Company operates the slicing business using diamond wires. (See

Characteristics and strengths

for details)
(2) High-precision Equipment Business
The development, manufacturing and sale of high-precision equipment made of hard and brittle materials with high abrasion resistance such as diamond, cemented carbide and ceramic.
The main products are diamond parts used in the engineering machines for manufacturing automobile parts and bearings and diamond nozzles, which are used in industrial machines for mounting electronic parts onto LCD television sets, smartphones, tablets, etc.
In addition to high-precision parts and equipment, the Company develops, manufactures and sells the cleaning machines for nozzles of the machines, etc.
(3) Chemical Fiber Spinning Nozzle Business
The designing, manufacturing and sale of chemical fiber spinning nozzles, the peripheral parts and nozzles and devices for nonwoven fabric.
Nakamura Choukou started the domestic manufacturing of nozzles for chemical fibers (for production of rayon) and has been operating the business as a chemical fiber spinning nozzle manufacturer since its establishment in 1930. The spinning nozzle is a core manufacturing part which determines the quality of nonwoven and carbon fibers. The manufacturing of the nozzles requires delicate technologies in micro punching process and in the production of the devices, where Nakamura Choukou has provided for the market's needs with the technologies accumulated for many years in the same specialized industry.
1-5 Characteristics and strengths
<Highly Competitive Diamond Wire>
Higher-load processing conditions than before are expected from a diamond wire, such as "a fewer amount of use," "faster processing" and "higher processing difficulty."
In these circumstances, the diamond wire of the Company satisfies the high-load conditions for both monocrystalline silicon processing and polycrystalline silicon processing in terms of the following.
(Amount of Use)
Comparing the amount of diamond wire used per wafer in customer evaluation, it is 20% less than the other companies' amount of use for both monocrystalline silicon processing and polycrystalline silicon processing, which is directly linked to cost reduction.
(Manufacturing Method)
In contrast with the Chinese manufacturers who produce six wires at the same time by the "six-line simultaneous production method," the Company produces one wire at a time while giving feedback on camera inspection and imaging, which is called the "single-line feedback control production method."
While the former has a disadvantage of variation in product quality despite the low cost, the Company has a big advantage that it can provide a stable quality. It has a weakness of high production costs, but recently, the Company is actively engaged in reforming production facilities aimed at high-speed production, and it is steadily reducing costs and improving productivity.
(Specifications)
The size of diamonds that are fixed in a wire is big in Chinese diamond wire and the friction of diamonds are also large because there are so many of them. It has a high cutting ability and is easy to operate, but the thickness of the wafers is uneven because it has a huge change in wire diameter, and the processing capacity is small. As a result, there are fewer benefits for users.
Although it is difficult to operate, the Company's diamond wire, on the other hand, uses small and fewer diamonds, so the friction at the time of processing is relatively small. Also, as the wire diameter is short, more wafers can be obtained. In addition, there is a large processing capacity, so the amount of wire used is less and benefits for users are significant.
(Thinning in Monocrystalline Wafers)
The Company's fine wire in the monocrystalline wafers, whose market is expected to expand further in the future, is highly competitive.
Firstly, on receiving a high evaluation from a top Korean manufacturer for giving the best cost performance, the Company started an exclusive supply of all Φ60μm wire.
Also, it began to supply Φ60μm wire for several monocrystalline users in China and Japan.
In addition, the Company received a high evaluation for samples of Φ50μm wire, which is more advanced than Φ60μm wire, from major Korean manufacturers and other top manufacturers in the world, so it is preparing to begin its sales in the current term.
In this manner, the Company aims to strengthen its position in the growing market based on three advantages it has, i.e., "High-performance Japanese wire whose stable procurement is difficult in China," "High-quality diamond fixation technology realizing highly difficult fixation in ultrafine wire zone" and "Challenging cost reduction realizing highly efficient production."
<The unique business model with the slicing business>
As mentioned above, Nakamura Choukou's slices silicon ingots using its own diamond wires, manufactures and sales silicon wafers for solar cells.
By making the results of mass production tests as feedback, Nakamura Choukou works on the improvement of the diamond wire based on the feedback.
By combining the "technologies of diamond wire manufacturing" and "technologies of diamond wire usage" to create a synergy effect, the Company has made it possible to support its clients (silicon wafers manufacturers) in different technological perspectives and gain trust from them, which in turn has made its market expansion advantageous.
This kind of business model is unique, which other companies do not have such examples, and this business model makes Nakamura Choukou stand out.
